Ruggedized backplane for harsh environments
The BMXXBP0600H is a 6-slot ruggedized backplane in the Modicon X80 range, designed for mounting I/O modules in severe environments. Its 307.6 mm width and 103.7 mm height define the rack footprint for panel layout, while the 6 bus X slots accommodate a mix of Modicon X80 modules. The backplane draws 1.68 W from the system supply – a low overhead for the bus power budget.
At 19 mm deep, the assembly stays shallow for slim enclosures. A single XBE expansion connector links the backplane to the CPU or previous rack.
Environmental endurance
Operates from -25 to 70 °C with 10–95 % non-condensing humidity. Conformal coating protects against moisture and contamination. Gas resistant to ISA S71.04 Gx and IEC 60721-3-3 class 3C4; dust and sand resistant class 3S4; salt level 2; mold and fungal spore resistant class 3B2. Rated for Hazardous Location Class I Division 2, making it suitable for oil, gas, and chemical plant installations.
Compliant with EN/IEC 61131-2, EN/IEC 61010-2-201, UL 61010-2-201, CSA C22.2 No 61010-2-201, IACS, EN/IEC 61000-6-5, EN/IEC 61850-3 location G, and EN/IEC 60079-0. Meets the Low Voltage, EMC, and ATEX directives.