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Fuji Electric PXR3-NEY2-GV0A1 — Process / Temperature Controllers

PXR3-NEY2-GV0A1 Temperature Controller, 1/32 DIN, 16 Ramp/So

MPNPXR3-NEY2-GV0A1

Fuji Electric PXR3-NEY2-GV0A1, advanced self-tuning 1/32 DIN temperature and process controller, 16 ramp/soak segments, lifecycle stage current.

$215.00Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026
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Product details

What the 16 ramp/soak segments mean for your process

The PXR3-NEY2-GV0A1: Sixteen ramp/soak segments let you program a multi-step thermal profile — ramp up at a controlled rate, soak at setpoint, ramp down, and repeat or end. This is the difference between a simple on/off thermostat and a process controller that can run a cure cycle, a solder reflow profile, or a semiconductor bake sequence without external PLC sequencing. The self-tuning algorithm adjusts PID parameters during the first run, reducing the need for manual loop tuning on each new installation.

Panel integration and form factor

At 1/32 DIN (approximately 24 x 48 mm panel cutout), this controller fits standard panel cutouts for compact enclosures. The shallow depth behind the panel suits DIN-rail terminal blocks or backplane wiring in control cabinets where space is tight. No forced-air cooling required for the controller itself — derating only applies to the output relay or SSR load if used near the maximum rated current.

Frequently asked questions

Where can I buy PXR3-NEY2-GV0A1 and how do I get a price?

This part is sourced and quoted to order against an RFQ through independent distribution. Submit a request for quote to confirm current availability and pricing.

What is PXR3-NEY2-GV0A1's listed description?

It is an advanced, self-tuning 1/32 DIN temperature and process controller with 16 ramp/soak segments.

What does the 16 ramp/soak segments feature do?

It allows programming a multi-step thermal profile — up to 16 segments of ramps and soaks — for processes like cure cycles, reflow profiles, or batch thermal processing without external sequencing.

MPN
PXR3-NEY2-GV0A1