The 3RF3900-0WA88 is a heat conducting foil designed specifically for the Siemens 3RF30, 3RF31, and 3RF51 series semiconductor relays. It's a thermal interface material that sits between the relay's power module and its heatsink, ensuring efficient heat transfer away from the semiconductor junction. For a sourcing buyer, this is the correct thermal pad to order when servicing or building out a panel with those relay families — using the wrong foil or omitting it entirely will degrade the relay's thermal performance and shorten its service life.
Siemens 3RF3900-0WA88 heat conducting foil, for 3RF30/31/51
MPN3RF3900-0WA88
Active
Siemens, Accessories, heat conducting foil for semiconductor relay 3RF30/31/51, 3RF3900-0WA88, RoHS compliant since 15-01-24.
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026
How we verify every order →Specifications
Specifications
| Parameter | Value |
|---|---|
| Group code | R711 |
| Product group | 3725 |
| Product class | A: Standard product which is a stock item could be returned within the returns guidelines/period. |
| Series | Accessories |
| Export control regulations | AL : N / ECCN : N |
| Compliance with the substance restrictions according to RoHS directive | Since: 15-01-24 |
Product details
Frequently asked questions
What compliance documentation is available for this part?
RoHS compliance is confirmed effective 15-01-24. REACH Article 33 candidate list information is available on request. No UL, CSA, or IEC certifications are listed for this accessory.
What is the group code and product group for this part?
The group code is R711 and the product group is 3725.
MPN
3RF3900-0WA88