The 6ES7134-6PA20-0CU0: The module draws 0.4 W typ. from the backplane, which leaves generous headroom in the ET 200SP power budget for additional slices. Diagnostic coverage includes overload, undervoltage/overvoltage (voltage swell and dip), line quality analysis, module fault, and a hardware interrupt that monitors up to 16 freely selectable process values for exceeding or undershooting limits. Firmware updates are possible via the backplane bus, and the HW functional state starts at FS02.
Mechanical: 20 mm wide, 73 mm high, 58 mm deep. Mounts on a BU type U0 base unit; any mounting position is acceptable. Wiring: shielded cables up to 200 m or unshielded up to 30 m. The module uses 2-wire connection per the BU U0 pinout. Automatic encoding of the base unit is supported. I&M data is supported from I&M0 to I&M3 for asset tracking.